United Microelectronics (TPE:2303) filed for the listing of $1.8 billion in bonds on the Singapore bourse, according to a filing with the Singapore Exchange on Tuesday.
The company filed for the listing of $900 million worth of currency-linked zero-coupon convertible bonds due 2028 and $900 million of currency-linked zero-coupon convertible bonds due 2031.
The bonds will be listed and quoted on the Bonds Market on Oct. 14, the filing said.
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