Samsung Electronics (KRX:005930) has presented its latest memory and storage technologies at the 2026 OCP Global Summit in the U.S., according to a company release.

The technologies look to address the rising demand for AI infrastructure, with applications including memory bandwidth, capacity expansion, KV cache offloading and high-density storage.

Demonstrated technologies include the company's tokenization solutions, such as the 12-layer high-bandwidth memory HBM4E and processing-in-memory solution LPDDR5X-PIM.

Other products included in the showcase are KV cache solutions such as scalable memory solution CMM-D MD310, server module SOCAMM2 and enterprise storage solutions SSD PM1763 and BM1773.

The company's showcase will run until Thursday.

Shares of the company fell more than 8% in recent trade.